Effects of Underfill Delamination and Chip Size on the Reliability of Solder Bumped Flip Chip on Board
نویسندگان
چکیده
An investigation on the solder bumped Flip Chip on Printed Circuit Board (FCOB) is presented in this paper. The emphasis is placed on the effects of delamination crack between the underfill encapsulant and the solder mask on the solder joint reliability of FCOB. In the present study, a fracture mechanics approach is employed. The strain energy release rate at the crack tip between the underfill and the solder mask is presented. The maximum inelastic stress and strain in the corner solder joint for all the investigated cases are calculated for comparison. The effects of chip size on the solder joint reliability of FCOB with perfect and imperfect underfills (including without underfill) are evaluated. The finding of this study should contribute to a better understanding in the thermalmechanical behavior of solder bumped Flip Chip assemblies.
منابع مشابه
Scanning Acoustic Microscopy Investigation of Engineered Flip-chip Delamination
The rapid uptake of flip-chip technology within the electronics industry, is placing the reliability of such assemblies under increasing scrutiny. A key feature of the assembly process is the application of underfill to reinforce the attachment of the die to the printed circuit board. This has been identified in numerous studies as one of the major ways in which the reliability of the devices c...
متن کاملDevelopment of No-Flow Underfill Materials for Lead-Free Solder Bumped Flip-Chip Applications
No-flow underfill process in flip-chip assembly has become a promising technology toward a smaller, faster and more cost-efficient packaging technology. The current available no-flow underfill materials are mainly designed for eutectic tin-lead (Sn/Pb) solders. With the advance of lead-free interconnection due to the environmental concerns, a new no-flow underfill chemistry needs to be develope...
متن کاملFlip Chip Reliability Modeling Based on Solder Fatigue as Applied to Flip Chip on Laminate Assemblies
In order to successfully implement reliable Flip Chip packaging technology, it is desirable to ensure solder fatigue as the limiting mechanical failure mechanism. Doing so enables the packaging engineer to design to specific reliability standards, as solder fatigue is a known and predictable failure mechanism. Indeed, other Flip Chip failure modes such as silicon fracture and underfill delamina...
متن کاملReliability Study of High-Pin-Count Flip-Chip BGA
A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package size, 15 to 25 mm in die size, and 672 to 1020 in ball count. With dies and packages so large, solder joint fatigue failure and underfill delamination, induced by thermal expansion mismatch, are a major concern. Finite element analysis was set up for efficient reliability analysis....
متن کاملReliability Evaluation of Underfill Encapsulated Pb- Free Flip Chip Package under Thermal Shock Test
Thermo-mechanical reliability of the solder bumped flip chip packages having underfill encapsulant was evaluated with thermal shock testing. In the initial reaction, the reaction product between the solder and Cu mini bump of chip side was Cu6Sn5 IMC layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and electroless Ni-P layer of the package side. ...
متن کامل